Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry - Candlesense

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Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry

Published June 16, 2025 at 04:00 PM

SAN JOSE, Calif.--(BUSINESS WIRE)---- $CDNS #CDNS--Cadence's expanded collaboration with Samsung Foundry includes a new multi-year IP agreement and joint development on the latest SF2P process node.