Resonac Launches 27-Member "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging

(6365.T) TOKYO--(BUSINESS WIRE)--Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc. These companies, all significant global leaders in the semiconductor supply chain, will jointly develop materials, equipment, and design tools optimized for panel-level organic interposers—semicondu